xMEMS To Showcase Technologies Powering Next-Gen AI Wearables At CES 2026

xMEMS Labs will be on-site at CES 2026 to showcase its innovations for the fast-accelerating market of AI-enabled wearable and mobile devices. The show will see xMEMS highlight two flagship piezoMEMS technologies uniquely suited for the new class of all-day-wearable, AI-powered consumer electronic: µCooling and Sycamore.

Billed as the world’s first air-pump-on-a-chip,  µCooling is a 1-mm-thin, solid-state micro-blower capable of delivering local, targeted airflow to manage heat from AI processors in devices too thin for mechanical fans. Sycamore is the world’s first silicon MEMS loudspeaker: a 1.28-mm-thin, 150 milligram driver delivering full-range, high-fidelity sound in a solid-state form factor up to 90% lighter than traditional speakers. This enables ultra-thin AI glasses, open-fit earbuds, headphones, and other AI voice-enabled devices that are more comfortable to wear and deliver clearer, richer sound.

“AI is accelerating a hardware renaissance,” said Mike Housholder, VP of Marketing and Business Development at xMEMS. “As devices get thinner and more powerful, they need solid-state piezoMEMS components that deliver high performance without the bulk. Sycamore and µCooling embody this shift – enabling richer sound, less weight, and precise thermal management in the new generation of AI wearables and mobile devices.”

At The Venetian, xMEMS will demonstrate how its latest MEMS technologies elevate performance, design, and comfort across product categories:

• AI Glasses: ultra-thin frames combining rich audio from Sycamore with silent, localized thermal management from µCooling to maintain surface temperatures that remain cool against the skin during on-device AI workloads and extended video recording.
• Headphones & Earbuds: full-range Sycamore sound with µCooling-enabled humidity and temperature control for all-day wear.
• Smartphones & Tablets: µCooling dissipating heat from AI-class processors inside increasingly compact enclosures.
• SSDs & Edge Compute: µCooling stabilizing thermals to maintain sustained throughput and zero data throttling in high-density storage and compute devices.

xMEMS will host demonstrations throughout CES 2026 at The Venetian, Suite 34-208. Click here to schedule an appointment.

 

See also: LG Unveils 136-inch LG MAGNIT Active Micro LED Display