Yamaha Motor to launch YRH10W hybrid placer
Yamaha Robotics is set to launch the new YRH10W hybrid placer on March 1, 2026, featuring the functions of a surface mounter for mounting electronic components onto printed circuit boards and a die bonder for handling semiconductor chips
The YRH10W is a wide-type model based on the existing YRH10 hybrid placer, compatible with increasingly mainstream 12-inch wafers, and can transport large printed circuit boards up to L510 x W460mm.
Combining the mounting accuracy from the YRH10 with the high-speed placement technologies refined through Yamaha Motor’s lineup of surface mounters gives the YRH10W a bare-chip placement speed of 14,000CPH3 when supplied with wafers and a high mounting accuracy of ±15 μm. It also comes with a variety of functions, providing versatility to enable a single machine to handle diverse production processes.
The YRH10W will be on display for the first time at NEPCON Japan 2026, an exhibition for electronics R&D, manufacturing, and packaging technology, held at the Tokyo Big Sight from January 21 to 23, 2026.
YRH10W Hybrid Placer
The automotive electronics market is demanding highly efficient power conversion and high reliability, driving increased demand for power modules as New Energy Vehicles (NEVs) gain popularity.
In response, a shift to 12-inch silicon wafer production, which lowers unit costs for chip components, is gaining momentum across the entire semiconductor market and, as a result, is driving up demand for mounting equipment compatible with these 12-inch wafers.
Additionally, for the mounting of power modules intended for NEVs, needs are increasing for batch mounting processes in which multiple individual circuit boards are arranged on a large carrier and mounted collectively for efficiency. Requirements for transporting large carriers are also increasing in accordance.
To address evolving market demands, Yamaha Motor has created the YRH10W as a hybrid platform that maintains the high speed and precision of the YRH10 while adding 12-inch wafer compatibility and large PCB transport capabilities. It also boasts a range of functions, offering high versatility and supporting diverse production processes, including the production of modular products.
YRH10W features include:
High-speed, high-accuracy, and high-quality mounting
By combining the high-accuracy placement technologies developed for the YRH10 with the high-speed placement technologies refined through Yamaha Motor’s surface mounters, the YRH10W delivers high productivity, with a bare-chip placement speed of 14,000 CPH when supplied with wafers, and a high accuracy of ±15 μm.
Using Mounting Height Compensation and Load Control features that measure PCB height and warpage, the YRH10W achieves highly repeatable, high-quality mounting. Additionally, utilising the All Image Tracer function enables early detection of potential causes of defects, such as mounting failures or pick-up errors, and helps maintain and improve mounting quality.
High versatility
The YRH10W supports mixed mounting of surface-mount devices and wafer components, and expanding compatible wafer sizes up to 12 inches enables multi-die mounting with 6-inch, 8-inch, and 12-inch wafers on a single platform.
The high-rigidity conveyor also contributes to high-accuracy mounting and supports the transport of large PCBs up to L150 x W460 x H20mm. A variety of features, such as the Solder Paste Transfer Unit and the Fiducial Camera Z-axis Variable Function, enable support for diverse production processes, including modular products.
Easy operation
The Wafer Pickup Condition Setup Utility allows visual configuration of wafer component pickup conditions, enabling easy setup without specialised skills.
Support features, including placement sequence optimisation and cycle time estimation, have also been enhanced to maximise overall equipment performance. Furthermore, as a common feature of YR Series platforms, the YRH10W features an easy-to-read and user-friendly graphical interface to simplify operation.