How 3D printed quantum sensors are pioneering the future of heterogeneous integration.
In the burgeoning field of quantum sensing, technological advancements are pushing the boundaries of what is possible. A prime example is the development of sensors based on nitrogen-vacancy (NV) centres in diamond, which have the extraordinary capability to measure the minuscule magnetic fields generated by neural currents in muscles and the brain. Despite their potential, the current limitations in size and cost are significant barriers to widespread adoption.
Heterogeneous integration using 3D printed electronics presents a transformative solution, promising to revolutionise the scale, cost, and scalability of these quantum sensors, with applications ranging from controlling prosthetics to aiding locked-in patients.
3D printing has revolutionised various industries by enabling rapid prototyping and cost-effective manufacturing of complex components. In the realm of quantum sensors, 3D printed electronics can integrate multiple materials and functionalities into a single device. This capability is crucial for the development of compact and affordable quantum sensors.
Heterogeneous integration in the context of electronics development refers to the assembly of different types of materials and electronic components into a single system. For quantum sensors, this means combining the diamond substrate housing NV centres with other essential electronic components like readout circuits, signal processors, and wireless communication modules. 3D printing technology enables this integration by precisely depositing particles of different conductive and dielectric materials, layer-by-layer to form complex structures that traditional manufacturing methods cannot achieve.
With the rapid advancement of sophisticated 3D printing technologies, heterogeneous integration now enables the development of free-form 3D electro-mechanical designs and intricate 3D line and spacing configurations. This technology also supports the implementation of true twisted pair transmission line routing and tridimensional routing, effectively minimising loss generators.
Moreover, the miniaturisation and condensation of devices are particularly invaluable for the creation of next-generation electronic systems. These capabilities allow for unprecedented flexibility in designing and manufacturing quantum sensors, paving the way for innovative applications and improved performance.
The DragonFly IV by Nano Dimension exemplifies the cutting-edge in 3D printed electronics, specifically tailored for creating sophisticated PCBs and electronic components. Additively Manufactured Electronics (AME) using the DragonFly IV eliminates many challenges associated with traditional PCB manufacturing, which involves over 70 steps, while allowing for innovative designs and new classes of parts.
Key technical specifications of the DragonFly IV focus on trace width, signal and plane layer thickness, via diameter and reliable printing materials.
The shift towards 3D printed electronics is democratising access to advanced research tools. Institutions like the University of Stuttgart and QSens are leading the way by adopting these technologies, highlighting a broader trend. The ability to produce sophisticated electronic components in-house allows universities and research labs to innovate more rapidly. This autonomy from traditional manufacturing constraints means faster design iterations and experimentation cycles, fostering a more dynamic and responsive research environment.
Quantum sensors integrated via 3D printing hold immense potential in various applications. In medicine, these sensors can be pivotal in developing advanced prosthetics controlled by neural signals, providing a significant quality-of-life improvement for amputees. Furthermore, for patients with conditions like locked-in syndrome, these sensors could enable new forms of communication by detecting and interpreting brain signals.
The future of 3D printed quantum sensors is bright, with ongoing research focusing on improving material properties, resolution, and integration techniques. As these technologies mature, we can expect a new era of quantum sensors that are more compact, cost-effective, and widely accessible, paving the way for innovative applications across various fields.
The integration of 3D printed electronics with quantum sensors based on NV centers in diamond marks a significant leap forward in sensor technology. This approach not only addresses current limitations in precision, noise reduction, size and cost but also opens up new possibilities for advanced applications in medicine and other fields. As 3D printing technologies continue to evolve, the future of quantum sensing looks increasingly promising, heralding a new age of innovation and accessibility in scientific research and practical applications.
Dr. Rafael Del Rey is director of global application engineering at Nano Dimension. www.nano-di.com
