Automating the construction of three-dimensional structures that are 10s of millimeters in size would revolutionize manufacturing of devices for optical, electrical and biomedical applications. An economical process for constructing such 3D microstructures would be to "program" the constituent parts to spontaneously come together and build the structures themselves. Driving micron to mesoscale components (roughly between 0.1 to 100 millimeters) to line up and dynamically assemble into the desired structures, however, remains an elusive goal.
