Above: President Joe Biden speaks at the New Albany groundbreaking ceremony for Intel's plant.
NEW ALBANY, Ohio (WCMH) - Intel has thunderously announced its coming computer chip-making factories in Ohio, complete with fanfare from Ohio State University and a thumbs-up on-site from President Joe Biden. And, the plant's boss says there is more to come.
President Joe Biden speaks Sept. 9, 2022, at the Intel Ohio semiconductor fabrication plant groundbreaking ceremony in New Albany. Members of the Ohio State University marching band, who performed throughout the event, watch from beside his podium. (NBC4 Photo/Mark Feuerborn)
President Joe Biden speaks at the Intel groundbreaking ceremony in Licking County, Ohio, near New Albany. Front-row attendees, left, include Gov. Mike DeWine and Intel CEO Pat Gelsinger. (NBC4 Photo/Mark Feuerborn)
President Joe Biden speaks at the Intel groundbreaking ceremony in Licking County, Ohio, near New Albany. (NBC4 Photo/Mark Feuerborn)
Intel's groundbreaking ceremony on Friday for its coming semiconductor fabrication plant in New Albany rolled out the blue carpet for guests. A massive tent flanked by U.S. Secret Service agents and Intel representatives awaited attendees brought in by shuttle starting at 7:30 a.m. As they made their way through the interior, a gallery gave them a virtual tour of one of the company's existing semiconductor fabrication plants before showing off the computer chip products it made.
Attendees fill every seat at Intel's groundbreaking ceremony in New Albany. (NBC4 Photo/Mark Feuerborn)
Attendees mingle inside a tent leading to the podium for Intel's groundbreaking ceremony. (NBC4 Photo/Mark Feuerborn)
Manufactured silicon, left, sits on display at Intel's groundbreaking ceremony in New Albany. Farther down the table, finished semiconductor chip products, like Intel CPUs, are also shown off. (NBC4 Photo/Mark Feuerborn)
An Intel rep takes two groundbreaking attendees on a virtual tour of one of the company's semiconductor fabrication plants. (NBC4 Photo/Mark Feuerborn)
Attendees gather inside a tent at Intel's groundbreaking ceremony in New Albany. (NBC4 Photo/Mark Feuerborn)
The path through the tent eventually led out to the main event, which started with a performance from the Ohio State University marching band. Ohio politicians -- including Gov. Mike DeWine -- took turns at the podium with Intel CEO Pat Gelsinger and other executives in sharing their excitement about the two new fabs coming into the company's fold, all while construction vehicles churned away in the background.
Midway through the morning's speakers, it was time to put words into action. Accompanied by Gelsinger, DeWine and numerous other executives and politicians, Intel Ohio General Manager Jim Evers put a shovel in the New Albany dirt, officially breaking ground at the company's newest semiconductor fabrication plant. While the company confirmed to NBC4 that construction crews had already begun work at the site at the beginning of July, the groundbreaking was symbolic. Gelsinger thought it told the world that Intel had all the pieces in place to put a Midwest stereotype to rest.
"The Rust Belt, it is dead," Gelsinger said. "The Silicon Heartland begins."
Ohio politicians and Intel representatives, including new plant manager Jim Evers, mingle after breaking ground at the New Albany plant site. The dirt previously had paint that read "Made In America." (NBC4 Photo/Mark Feuerborn)
From left to right: Ohio First Lady Fran DeWine, Gov. Mike DeWine, Intel CEO Pat Gelsinger and his mother E. June Gelsinger pose for a photo at Intel's groundbreaking ceremony in New Albany on Sept. 9, 2022. President Biden is expected to deliver remarks at the event. (NBC4 Photo/Karina Cheung)
Intel CEO Pat Gelsinger greets attendees at the groundbreaking ceremony for the tech company's fabrication plant in New Albany, Ohio on Sept. 9, 2022. (NBC4 Photo/Mark Feuerborn)
Intel CEO Pat Gelsinger speaks moments before introducing President Joe Biden at the plant groundbreaking ceremony in New Albany, Ohio on Sept. 9, 2022. (NBC4 Photo/Mark Feuerborn)
Biden, who arrived in Ohio the same morning via Air Force One, took the stage immediately after the company's CEO. He responded directly to the CEO's previous comment, saying the Ohio plant had national implications, and that "Made in America" was no longer just a slogan.
“America invented the semiconductor, as you know, but today, 90% of them are made overseas," Biden said. "Pat, all of you, that stops today.”
The new plant's boss was equally ambitious in his talking points in front of a crowd of hundreds. He also shared an invitation to Ohioans.
"Sign on with Intel and come fill this field of dreams," Evers said.
Intel Ohio General Manager Jim Evers walks around the groundbreaking ceremony for his new semiconductor fabrication plant. (NBC4 Photo/Mark Feuerborn)
Intel Ohio General Manager Jim Evers addresses the crowd at the groundbreaking ceremony for his new plant. (NBC4 Photo/Mark Feuerborn)
Intel Ohio General Manager Jim Evers speaks at the podium at the groundbreaking ceremony for his new plant. (NBC4 Photo/Mark Feuerborn)
The general manager told NBC4 he was in the process of moving to Ohio from Arizona, where Intel has another semiconductor fabrication plant. Alongside inviting Ohioans to join him at his new plant, Evers said he also invited new neighbors to join him in the state.
"There's a lot of suppliers for Intel that are already here, that their operations have to go to be able to support us," Evers said. “I kind of gave the suppliers the encouragement, 'Hey, the CHIPS Act is done, we’re going to get going. It’s time that you guys get going as well and come to Ohio,' so since then I think I’ve heard that a lot of people have progressed their plans as well to move forward."
The new plant's general manager stopped short of sharing any business names that could be following Intel on its Ohio venture. However, in 2016 the company did share 27 companies that it called "preferred quality suppliers," for its other American plants.
Intel Ohio General Manager Jim Evers speaks with reporters. (NBC4 Photo/Mark Feuerborn)
This list from Intel demonstrates the potential companies and types of industries that could be coming:
Amkor Technology Inc.: semiconductor advanced packaging design, assembly and test services
ASM International: front-end equipment supplier for atomic layer deposit, plasma-enhanced ALD, metal gate and diffusion
Daewon Semiconductor Packaging Industrial Co. Ltd.: plastic injection molded tray media for bare die automation, substrate transport, device assembly and test, final shipping and storage, bare die tape and reel media for bare die transport
Daifuku: automated material handling systems
DISCO Corporation: precision cutting, grinding and polishing machines
EBARA Corporation: chemical mechanical polishers, plating systems, and dry vacuum pumps and abatement systems
Edwards Vacuum LLC: vacuum system products and abatement solutions
Fujimi Corporation: chemical mechanical planarization and silicon polishing slurries
Hitachi High-Technologies Corporation: dry etching, ashing, metrology and advanced packaging systems
Hitachi Kokusai Electric Inc.: batch processing and single wafer processing systems
JLL: facilities management
KLA-Tencor Corporation: process control and yield management solutions
Lam Research Corporation: fab capital equipment
Mitsubishi Gas Chemical Company Inc.: high-purity peroxide and custom back-end cleans
ModusLink Global Solutions Inc.: channel box CPU for Penang, Shanghai and Miami, and finished goods warehouse distribution for Miami
Murata Machinery Ltd.: automated material handling systems, hoist vehicles and stockers
The PEER Group Inc.: automation software and services
SCREEN Semiconductor Solutions Co. Ltd.: wafer cleaning and anneal equipment and services for semiconductor manufacturing
Shin Etsu Chemical Co., Ltd: silicon wafers, advanced photoresists, photomask blanks, and thermal conductive materials.
Shinko Electric Industries Co. Ltd.: plastic laminated packages and heat spreaders
Siltronic AG: polished and epitaxial silicon wafers
Tokyo Ohka Kogyo Co. Ltd: high-purity photoresists, developers, cleaning solutions and supporting chemistries
Tosoh SMD, Inc.: sputtering targets
Tosoh Quartz Inc.: quartzware for semiconductor wafer processing equipment
VWR: products, services and solutions to laboratory and production facilities
Veolia North America: waste management services
Nanium: outsourced semiconductor packaging, assembly and test provider
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