Intel: At least 3 PCs with Lakefield chips coming this year
Intel’s new “Lakefield” processors is the first chip manufactured using the company’s Foveros 3D technology. The company says that means that rather than laying out the components on a flat, pancake-like surface, Lakefield chips are more like a cake with multiple layers… if that cake measured just 12mm x 12mm x 1mm. The design allows […]
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